ProcurementMaterial: CEM-1,CEM-3,FR-4,ALUMINUM,ROGERS
Layer: 1-24 layers
Board thickness: 0.2-4.0mm
Copper Thickness: 0.5~9 Oz
Min Hole: 0.1mm
Min Track and Track Space: 0.075mm
Solder Mask Colour: GREEN/BLACK/WHITE/BLUE/RED/YELLOW...
Surface Treatment: OSP/HASL/HAL LEAD FREE/ENIG/CARBON/GOLDEN FINGER/IMMERSION TIN/IMMERSION SILVER
E-Test: Fly Probe Test/Set Up Test/AOI/Impedance Test
Special MTM: Blind vias,Buried vias,Counter hole,Halogen Free material,Resinhole plugging....
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