Supply技术参数 Specifications
型号(Model)
BY-300EDR
BY-400EDR
BY-500EDR
工作范围(Work area)
300(X)╳300(Y)╳100(Z)
400(X)╳400(Y)╳100(Z)
500(X)╳500(Y)╳100(Z)
旋转角度(Rotating angle)
±360º
解析度(Resolution)
0.01mm
重复精度(Repeatability)
±0.03mm
操作系统(Operation system )
液晶面板/手持式编程器(LCD panel /Teach pendant)
传动方式(Drive Mode)
微步进马达/皮带(Micro stepping motor /belt)
电源
Power supply
AC220V 50-60HZ 0.7KW
外观尺寸(Size)
490(L)*528(W)*679(H)
590(L)*628(W)*679(H)
690(L)*728(W)*679(H)
重量
Weight
约35KG(About35KG)
约45KG(About45KG)
约58KG(About58KG)
工作环境
Work condition
湿度：20-90%，温度0-40℃(Humidity 20-90%,Temperature 0~40℃)
应用：Application
1.适用流体点胶，例如： UV胶、AB胶、EPOXY(黑胶)、白胶、EMI导电胶、SILICON、树脂、瞬间胶、
银胶、红胶、膏、散热膏、防焊膏、透明漆、螺丝固定剂等；
It is applied to fluid dispensing, such as, UV glue, AB glue,COB(black glue), white glue, EMI conductive
glue, silicon, epoxy resin, instant glue, silver glue, red glue, paste, thermal grease, welding control paste,
transparent paint, screw fixative and so on.
2.应用于PCB电子配件固定及保护，手机、笔记本外壳粘接，LCD玻璃，LED点胶，摄像头点胶与封装，指纹模组点胶，汽车配件涂覆，芯片绑定，电池封装，喇叭点胶，SMT底部填充、元件封装、点膏、点红胶、点黑胶、半导体封装、晶元固定等
Applied to PCB electronic accessories fixed and protection, and mobile phone, notebook shell adhesive, LCD glass, LED point glue, dual cameras dispensing with encapsulation, fingerprint module point glue, auto parts coated, chip binding, battery encapsulation, horn point glue, SMT at the bottom of the filling, packaging, dispensing, points the red plastic, vinyl, semiconductor packaging, wafer fixed and etc .
Author
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